Sony subLVDS to Parallel Bridge

Numerous Sony image sensors that have resolutions higher than 720p60 are no longer able to use a traditional CMOS parallel interface. With the introduction of the IMX172 (4k x 2k resolution), IMX136 (1080p), IMX104 (720p) and the mature IMX036, Sony has moved to utilizing different subLVDS interfaces. To support the higher bandwidth needs of the IMX172, IMX136 and IMX104, Sony utilizes a serial subLVDS interface. This allows their image sensor to support higher resolutions & frame rates. These image sensors support multiple subLVDS output data lanes. Sony's serial interface is the preferred implementation for bridging their sensors as many of their future sensors will also offer this serial interface. The Lattice MachXO2-1200 can inteface to the Sony sensor and support up to 750Mbps serial data rate on each data lane. The Lattice Sony subLVDS to Parallel CMOS sensor bridge design makes an ISP think it is connected to an image sensor with a CMOS interface.

Sony Bridge Block Diagram

Features

  • 苏pports Sony IMX172, IMX136, IMX104 and IMX036
  • Complete Reference Designs in MachXO2-1200 or XP2-5
  • Designed to Emulate Parallel Sensor Output Bus Width of 10 or 12 Bits
  • Serial sub-LVDS interface to CMOS SDR data
  • Drives XVS & XHS for the IMX172
  • Legacy sub-LVDS parallel DDR to CMOS SDR also available
  • Converts the Sub-LVDS Sync Commands to Line Valid and Frame Valid Signals
  • Bridge Device Offered in Space-saving 8x8 mm 132-Ball csBGA. TQFP Packages Also Available.
  • Requires No External PROM
  • Parallel Interface can be Configured for 1.8V, 2.5V or 3.3V LVCMOS Levels

Jump to

Block Diagram

Performance and Size

Device Family1 Tested Devices* Performance I/O Pins Design Size Revision
clk clkx2
ECP5™5 LFE5UM-85F_8MG756C >108 MHz >216 MHz 42 202 LUTs 1.6
LatticeECP3™2 LAE3-17EA-6MG328E >108 MHz >216 MHz 42 215 LUTs 1.6
LatticeXP2™3 LFXP2-5E-5M132C >108 MHz >216 MHz 42 262 LUTs 1.6
MachXO2™4 LCMX02-1200HC-6MG132C >108 MHz >180 MHz 42 212 LUTs 1.6

1. drive_mode = 0, ad_conv_width = 12.
2. Performance and utilization characteristics are generated using LAE3-17EA-6MG328E, with Lattice Diamond® 3.1 design software. When using this design in a different device, density, speed or grade, performance and utilization may vary.
3. Performance and utilization characteristics are generated using LFXP2-5E-5M132C, with Lattice Diamond 3.1 design software. When using this design in a different device, density, speed or grade, performance and utilization may vary.
4. Performance and utilization characteristics are generated using LCMX02-1200HC-6MG132C, with Lattice Diamond 3.1 design software with LSE (Lattice Synthesis Engine). When using this design in a different device, density, speed or grade, performance and utilization may vary.
5. Performance and utilization characteristics are generated using LFE5UM-85F_8MG756C, with the Lattice Diamond 3.1 design software with LSE. When using this design in a different device, density, speed or grade, performance and utilization may vary.

* May work in other devices as well.

Note: The performance and design sizes shown above are estimates only. The actual results may vary depending upon the chosen parameters, timing constraints, and device implementation. See the design's documentation for details. All coding and design work was done on a PC platform unless noted otherwise.

Documentation

Quick Reference
Technical Resources
Information Resources
TITLE NUMBER VERSION DATE FORMAT SIZE
Sony Serial Sub-LVDS to CMOS Parallel Sensor Bridge
RD1130 01.2 10/10/2012 PDF 1.8 MB
TITLE NUMBER VERSION DATE FORMAT SIZE
Sony Parallel Sub-LVDS-to-Parallel Sensor Bridge User's Guide
RD1122 1.7 1/25/2015 PDF 555.6 KB
Sony Parallel sub-LVDS Sensor Bridge - Source Code
RD1122 1.7 1/2/2015 ZIP 2.5 MB
Sony serial sub-LVDS sensor bridge reference design
增强对我X136 & IMX104
5/22/2013 ZIP 2 MB
TITLE NUMBER VERSION DATE FORMAT SIZE
Sony Sub-LVDS-to-Parallel Sensor Bridge Product Brief
I0216 9/7/2012 PDF 925.1 KB
苏b-LVDS-to-Parallel Sensor Bridge Product Brief (Japanese Language Version)
I0216J 6/21/2012 PDF 696.9 KB
Camera Solutions Product Brief
IO232 4/25/2013 PDF 2.8 MB
Dual Image Sensor Product Brief
4/3/2012 PDF 1.2 MB

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